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Diamond substrate
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Diamond has a thermal conductivity of up to 2200 W/mK at room temperature, which is five times that of copper. This makes it highly effective for dissipating heat in RF, opto-electronic, power, and AI chips, significantly enhancing their power, lifespan, and stability. We offer a range of diamond products, including single-crystal and polycrystalline diamond, along with metallization and bonding solutions.
Product Description
Main parameters
| Thermal conductivity | Sizes | Thickness | |
| Single Crystal Diamond | 2000W/mK | 5*5mm-20*20mm | 0.15-3mm |
| Polycrystalline Diamond | 1200-2000W/mK | 2 inch/3 inch | 0.1-1mm |
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